Multimedia soc with advanced jack sense applications

ABSTRACT

In a multimedia SOC that includes a plurality of jack sense modules coupled to the plurality of video output pins, a processing module functions to: enable one or more of the plurality of jack sense modules to determine a video connection to the SOC, enable a video decoder in a first mode when the video connection is of a first type, and enable the video decoder in a second mode when the video connection is of a second type

CROSS REFERENCE TO RELATED PATENTS

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STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

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INCORPORATION-BY-REFERENCE OF MATERIAL SUBMITTED ON A COMPACT DISC

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BACKGROUND OF THE INVENTION

1. Technical Field of the Invention

This invention relates generally to mixed signal circuitry and moreparticularly to jack sense applications.

2. Description of Related Art

In general, a system on a chip (SOC) integrates multiple independentcircuits, which are typically available as individual integratedcircuits, on to a single integrated circuit. For example, a multimedia(e.g., audio, video, graphics, and/or text) processing SOC combines aprocessing core (e.g., microprocessor and/or digital signal processor,instruction cache, and data cache), an audio codec (e.g., digitizationof analog audio input signals and converting digitized audio signalsinto analog output signals), a high speed serial interface (e.g.,universal serial bus (USB) interface), a display interface, a videodecoder, video digital to analog converters (DACs), and an externalmemory interface.

In a multimedia SOC, the video decoder outputs a digital video signal ina component, composite, or S-video format. One or more of the video DACsconverts the digital video signal into an analog video signal, which isprovided to one or more off-chip video output jacks. Typically, one ormore 75 Ohm cables are coupled to the one or more off-chip video outputjacks to provide the analog video signal to an analog video display,which has a load impedance of 75 Ohms. To provide impedance matching,the output of each video DAC is terminated with a 75 Ohm load, which maybe on chip or off chip. This, however, requires sufficient power todrive the 75 Ohm load and the 75 Ohm termination.

To reduce the power requirements, short video cables (e.g., less than0.5 meter) may be used such that the 75 Ohm termination may be omitted.While this reduces the power requirements for the video output, it doesso at the cost of requiring short video cables, which may be impracticalfor many uses of the SOC.

Since the analog video signal may be outputted on one or more videooutput jacks, it is desirous to only activate the video DACs that areconnected to a cable. As such, many multimedia SOCs include jack sensecircuitry to detect when a cable is coupled to a particular jack. Aknown embodiment of a jack sense circuit includes a pull up resistor, amechanical switch, and use of a general purpose input/output (GPIO) pin.When a cable is plugged into a jack, the mechanical switch is closed,coupling the pull up resistor to ground. The GPIO pin is coupled to thecommon node of the mechanical switch and the pull up resistor, which, inthis state, is coupled to ground via the closed mechanical switch. Whena cable is not connected to the jack, the mechanical switch is open andthe pull up resistor is floating. The GPIO pin is pulled up to Vdd viathe pull-up resistor to indicate that no cable is connected to the jack.

While the above described jack sense circuit works to detect whether acable is plugged into a jack, it requires the use of a GPIO pin and apull up resistor for each of the video DAC outputs. In addition, thejack sense circuit only detects whether a cable is plugged into a jack;it does not detect whether other end is coupled to a load, or whetherthe load is a video display or headphones. As such, if a floating cableis connected to a jack, the jack sense circuit provides a positiveindication, which is used to enable the corresponding video DAC. Thiswastes power since the enable video DAC is not being used since thecable is not connected to a video display.

Therefore a need exists for a multimedia SOC that includes an improvedjack sense circuit and/or includes a more efficient video DAC.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)

FIG. 1 is a schematic block diagram of an embodiment of a multimediasystem on a chip (SOC) in accordance with the present invention;

FIG. 2 is a schematic block diagram of an embodiment of a video digitalto analog converter (DAC) in accordance with the present invention;

FIG. 3 is a schematic block diagram of another embodiment of a videodigital to analog converter (DAC) in accordance with the presentinvention;

FIG. 4 is a schematic block diagram of another embodiment of a videodigital to analog converter (DAC) in accordance with the presentinvention;

FIG. 5 is a schematic block diagram of another embodiment of a videodigital to analog converter (DAC) in accordance with the presentinvention;

FIG. 6 is a logic diagram of an embodiment of a method of powerreduction via jack sensing in accordance with the present invention; and

FIG. 7 is a schematic block diagram of an embodiment of a jack sensingmodule in accordance with the present invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is a schematic block diagram of an embodiment of a multimediasystem on a chip (SOC) 10 that includes a processing module 12, readonly memory (ROM) 14, random access memory (RAM) 16, an external memoryinterface 18, an audio decoder 20, a video decoder 22, an audio encoder24, at least one an analog to digital conversion (ADC) module 26, atleast one audio digital to analog conversion (DAC) module 28-30 (twoshown for left and right channel), a plurality of video DAC modules32-36 (three shown), a bus structure 38, a plurality of video outputpins 40-44, and a plurality of jack sense modules 46-50. Note that theSOC 10 may further include a host interface such as a universal serialbus (USB). Further note that the audio decoder 20, the video decoder 22,and/or the audio encoder 24 may be separate processing modules and/orincluded within the processing module 12.

Processing module 12 may be a single processing device or a plurality ofprocessing devices. Such a processing device may be a microprocessor,micro-controller, digital signal processor, microcomputer, centralprocessing unit, field programmable gate array, programmable logicdevice, state machine, logic circuitry, analog circuitry, digitalcircuitry, and/or any device that manipulates signals (analog and/ordigital) based on hard coding of the circuitry and/or operationalinstructions. The processing module may have an associated memory and/ormemory element, which may be a single memory device, a plurality ofmemory devices, and/or embedded circuitry of the processing module. Sucha memory device may be a read-only memory, random access memory,volatile memory, non-volatile memory, static memory, dynamic memory,flash memory, cache memory, and/or any device that stores digitalinformation. Note that when the processing module implements one or moreof its functions via a state machine, analog circuitry, digitalcircuitry, and/or logic circuitry, the memory and/or memory elementstoring the corresponding operational instructions may be embeddedwithin, or external to, the circuitry comprising the state machine,analog circuitry, digital circuitry, and/or logic circuitry. Furthernote that, the memory element stores, and the processing moduleexecutes, hard coded and/or operational instructions corresponding to atleast some of the steps and/or functions illustrated in FIGS. 1-8.

In a video playback mode, the video decoder 22 independently, and/orunder the control of the processing module 12, retrieves a stored videofile. The video file may be stored in on-chip memory and/or off-chipmemory, where the off-chip memory is accessed via the external memoryinterface 18. Upon retrieving the stored video file, or a portionthereof, the video decoder 22 decodes the file to produce a digitalvideo signal. The decoding may be in accordance with a video codingprotocol such as one or more versions of MPEG (motion picture expertgroup), may be in accordance with a proprietary video coding protocol,and/or any other type of video decompression.

Depending on the type of video file and/or upon the selected videocoding protocol, the video decoder 22 will produce a composite videooutput, an S-video output, a component video output, and/or other typeof video output format. As is known, composite video is provided as asingle signal, S-video is provided as two signals (e.g., brightness andcolor), and component video is provided as two or more signal components(e.g., YPrBr and/or RGB). Thus, the video decoder 22 will output one ormore signals in accordance with the particular video format.

In an embodiment, the jack sense modules 46-50, when enabled by theprocessing module 12 via a jack sense enable signal 52, determinewhether a cable is connected to the corresponding video output pin40-44. Based on the number of cables connected to the corresponding pins40-44, the processing module 12 determines the particular video format.For example, if one cable is connected, the processing module 12determines that the video format should be composite video; if twocables are connected, the processing module 12 determines that the videoformat should be S-video; and if three cables are connected, theprocessing module 12 determines that the video format should becomponent video. Upon make this determination, the processing module 12provides an indication to the video decoder 22 such that the videodecoder 22 processes the stored video file in accordance with thedesired video output format.

In addition, the processing module 12 may enable only the video DACmodules 32-34 that are needed for the corresponding video output format.For example, when the video output format is composite video, only onevideo DAC module needs to be enabled; when the video output format isS-video, two video DAC modules need to be enabled; and when the videooutput format is component video, three video DAC modules need to beenabled. In addition, when no cable connections are detected, theprocessing module 12 may disable the video decoder 22 and the video DACmodules 32-34. As such, only the circuitry that is needed to support thevideo output connections is enabled, thereby reducing power consumption.

In an audio playback mode, the audio decoder 20 independently, and/orunder the control of the processing module 12, retrieves a stored audiofile or audio portion of a video file. The audio and/or video file maybe stored in on-chip memory and/or off-chip memory, where the off-chipmemory is accessed via the external memory interface 18. Upon retrievingthe stored audio file, or a portion thereof, the audio decoder 20decodes the file to produce a digital audio signal. The decoding may bein accordance with an audio coding protocol such as one or more versionsof MPEG (motion picture expert group), may be in accordance with aproprietary audio coding protocol, and/or any other type of audiodecompression.

The audio decoder 20 provides the digital audio signal to one or more ofthe audio DACs 28-30. The audio DACs 28-30 convert the digital audiosignal into an analog audio signal, which is provided off chip to one ormore speaker jacks and/or headphone jacks. While not shown, the SOC 10may further include volume adjust circuitry coupled to the output of theaudio DACs 28-30 to adjust the volume of the outputted analog audiosignals.

FIG. 2 is a schematic block diagram of an embodiment of a video digitalto analog converter (DAC) module 32-36 that includes one or more digitalto analog (DAC) modules 60-62 and a gated termination 64. The one ormore digital to analog conversion modules 60-62 (embodiments of whichwill be described in greater detail with reference to FIGS. 3 and 4) iscoupled to convert at least one bit of a digital signal 66 into ananalog signal 68. One or more of the video output pins 40-44 outputs theanalog signal 68.

The gated termination 64 (embodiments of which will be described ingreater detail with reference to FIGS. 3 and 4) is coupled to the analogoutput of the one or more digital to analog conversion modules 60-62 andis coupled to receive a termination selection signal. When thetermination selection signal 70 is in a first state (e.g., singletermination mode), the gated termination 64 provides a first terminationand, when the termination selection signal is in a second state (e.g.,double termination mode), the gated termination 64 provides a secondtermination.

FIG. 3 is a schematic block diagram of another embodiment of a videodigital to analog converter (DAC) module 32-36 that includes the one ormore digital to analog (DAC) modules 60-62, a shared dump impedance RI(note that each DAC module 60 could include its own dump impedance) andthe gated termination 64. Each of the DAC modules 60-62 includes acurrent source (CS1) and switches (S1 and S2). The gated termination 64includes a switch (S3) and an impedance (R2).

In operation, when a bit of the digital signal 66 is in a first state(e.g., logic 0), switch S1 is closed and switch S2 is open such that thecurrent of the current source SC1 is steered to the dump impedance RI,which may be a resistor, a transistor, inductor, and/or capacitor, toground. When the bit of the digital signal 66 is in a second state(e.g., logic 1), switch S1 is open and switch S2 is closed such that thecurrent of the current source CS1 is provided to the analog output toprovide at least a portion of the analog signal 68. Note that each DACmodule 60-62 may have a different valued current source to providediffering levels of digital to analog conversion and/or the DAC modules60-62 may have the same valued current sources that drive a resistordivider to provide the differing levels of digital to analog conversion.For example, a 4-bit digital to analog converter includes 4 DAC modules,where a first DAC module corresponds to the most significant bit (MSB)of a 4-bit digital value; a second DAC module corresponding to thesecond MSB of the 4-bit digital value; a third DAC module correspondingto the third MSB of the 4-bit digital value; and a fourth DAC modulecorresponding to the least significant bit (LSB) of the 4-bit digitalvalue. In this example, the first DAC module provides ½ or 0 of a fullscale analog current signal based on the MSB, the second DAC moduleprovides ¼ or 0 of a full scale analog current signal based on thesecond MSB, the third DAC module provides ⅛ or 0 of a full scale analogcurrent signal based on the third MSB, and the fourth DAC moduleprovides 1/16 or 0 of a full scale analog current signal based on theLSB. As another example, a DAC may include multiple (e.g., 15) DACmodules of the same size using a thermometer code scheme to produce adesired analog output. In yet another example, a DAC may be segmented toinclude some modules having binary coding (e.g., 6 modules) and somethermometer coding (e.g., 6 modules).

In an alternative embodiment, the current sources (e.g., CS1) may be avariable current source that provides a first current when thetermination selection signal 70 is in the first state and provides asecond current when the termination selection signal is in the secondstate 70. For example, if the first state corresponds to a singletermination mode (e.g., no impedance matching on the chip side of thevideo cable), the current source is adjusted to provide approximately of15/n milli-amps, where n is the number of thermometer coded modules.Continuing with this example, if the second state corresponds to adouble termination mode (e.g., includes impedance matching on the chipside of the video cable), the current source is adjusted to provideapproximately 30/n milli-amps. In general, the current source providesabout ½ the current in the single termination mode as it does in thedouble termination mode.

As shown, the gated termination includes an impedance R2 (e.g., aresistor, a transistor, a capacitor, and/or an inductor) and a switchS3. The switch S3 is controlled by the termination selection signal 70,which may be received via an input pin of the SOC. When the terminationselection signal 70 is in the first state (e.g., no impedance matchingon the chip side of the video cable for a single termination mode), theswitch S3 is open to provide the first termination (e.g., an opencircuit which has no load) and, when the termination selection signal isin the second state (e.g., includes impedance matching on the chip sideof the video cable for a double termination mode), the switch S3 isclosed to provide the second termination (e.g., 75 Ohms).

FIG. 4 is a schematic block diagram of another embodiment of a videodigital to analog converter (DAC) module 32-36 that includes the one ormore digital to analog (DAC) modules 60-62, a dump impedance RI, aswitch S4, and the gated termination 64. Each of the DAC modules 60-62includes a current source (CS1) and switches (S1 and S2). The gatedtermination 64 includes a switch (S3) and an impedance (R2). In anembodiment, R1 is a variable resistor having a resistance approximately½ of the resistance of R2 in a double termination mode and having aresistance approximately equal to the resistor of R2 in a singletermination mode. In an alternative embodiment, each DAC module 60-62may include its own dump impedance, where the parallel combinationequates to R1.

In this embodiment, switch S4 directs the current of the dump nodes ofthe DAC modules 60-62 to either the dump impedance R1 or to a secondsupply voltage Vdd2. When in a dump to VDD mode, switch S4 couples thedump nodes of the DAC modules 60-62 to the second supply voltage Vdd2,which may be at least partially produced by current source CS2. Forinstance, current source CS1 is supplied by supply voltage Vdd1, whichis of a greater value than Vdd2. In this manner, the energy that isdumped by the DAC modules is substantially recaptured and used foranother supply voltage (e.g., Vdd2). For example, approximately ⅔rds ofthe energy dumped into the dump impedance can be recaptured in thismanner.

Since energy is being recovered and used for the second supply voltage,the source of the second supply voltage can be scaled back. To achievethis, a power control module 71 is coupled to regulate the currentprovided by a second current source CS2 associated with the secondsupply voltage source. Note that the power control module 71 may be astand alone processing module or included with processing module 12 andthat it may provide a control signal to the second current source toregulate the current provided by the second current source CS2. Furthernote that the second supply voltage may be provided by a DC-DC converterthat has its regulation adjusted based on the current dumped by the DACmodules. Still further note that the switches S1-S3 may be implementedvia switches, transistors, gated circuits, etc.

FIG. 5 is a schematic block diagram of another embodiment of a videodigital to analog converter (DAC) module 32-36 that includes one or moredigital to analog (DAC) modules 60-62, the gated termination 64, and anoperating conditions module 75. In this embodiment, the operatingconditions module 75, which may be a stand alone module or includedwithin processing module 12, determines the termination selection signal70 based on operating conditions 72. The operating conditions 72 mayinclude cable length, signal quality, video type, bandwidth, loadimpedance, etc.

As an example, when the connected video cable is short (e.g., less than0.5 meters), the operating conditions module 75 determines that thefirst state (e.g., single termination mode) of the termination selectionsignal 70 will provide an acceptable termination level. As anotherexample, when the connected video cable is long, the operatingconditions module 75 determines that the second state (e.g., doubletermination mode) of the termination selection signal 70 will provide anacceptable termination level. Note that while the video DACs of FIGS.3-5 are shown as having a single ended output, each DAC could have adifferent output. In this instance, the current would be dumped toground.

FIG. 6 is a logic diagram of an embodiment of a method of powerreduction via jack sensing that begins at step 80 when the processingmodule 12 disables the video DACs and enables one or more of the jacksection modules. The method then proceeds to step 82 where theprocessing module determines, via the one or more enabled jack sensesections, whether a video cable is connected to a corresponding videojack. If not, the method loops until at least one video cable connectionis detected.

If at least one video cable connection is detected, the method proceedsto step 84 where the processing module determines whether the impedanceof the cable connection is acceptable. For example, a typical videocable has an impedance of 75 Ohms, a headphone set has an impedance of50 Ohms, an open circuit has a large impedance, and a short has animpedance near 0 Ohms. If an impedance of approximately 75 Ohms isdetected, the impedance will be deemed acceptable. If a lower value(e.g., 50 Ohms or near 0 Ohms) is detected, then the impedance will bedeemed to be unacceptable. Similarly, if a large impedance is detected(e.g., an open circuit), then this impedance is also deemed to beunacceptable. If an unacceptable impedance is detected, the processproceeds to step 86 where the processing module determines whether thevideo connection has come unplugged. If so, the method loops back tostep 82. If the connection has not become unplugged, the method waitsuntil an acceptable impedance is detected. Note that this is done foreach enabled jack sense module.

If the impedance of each video connection is acceptable, the methodproceeds to step 88 where the processing module determines how manychannels are connected and enables a corresponding number of video DACs.Note that composite video typically uses one video connection, S-videotypically uses two video connections, and component video typically usesthree video connections.

The method then proceeds to step 90 where the processing module monitorsthe one or more video connections to determine whether one or more ofthe connections has disconnected. If, the method continues to monitorfor a disconnection of one or more video cables. If a disconnection isdetected, the method reverts to step 80.

FIG. 7 is a schematic block diagram of an embodiment of a jack sensingmodule 46-50 that includes a switch S4, an impedance R3, a circuit 110(which may be implemented by a logic gate having an inherent tripvoltage approximating a reference voltage or a comparator comparing thevoltage on the video output pin to a voltage reference), an impedancecomparator 112, and a disconnect detector 114. The impedance R3 may be apull up resistor that is coupled to one of the video output pins 40-44.In operation, when the switch S3 is closed via a signal from theprocessing module 12, the pull up resistor R3 is coupled to Vdd. If noload is present on the corresponding video output pin 40-44, the inputof the circuit 110 will be pulled high. In this state, the circuit 110will indicate that no load is coupled to the video output pin 40-44.

In addition, the disconnect detector 114 will indicate a disconnection(i.e., a connection is not currently made) and the impedance comparator112 will indicate a high impedance or an improper impedance. Forexample, a proper video connection will have an impedance ofapproximately 75 Ohms (or some other known impedance). When noconnection is made, the video pin 40 or 44 will have a large impedancevalue,. When compared to the desired 75 Ohms, the impedance comparator112 will indicate the mismatch as either a high impedance or simply asan improper impedance.

If, however, a load is present on the corresponding video output pin40-44, then the input of the circuit 110 will be low. In this state, thecircuit 110 will indicate that a load is coupled to the video output pin40-44. In addition, the impedance comparator 112 will provide a properconnection indication if the connection has the desired impedance (e.g.,75 Ohms) or will provide an improper connection indication if theconnection has an impedance not substantially equal to the desiredimpedance. For example, if the video connection is a short, thecomparator 110 will indicate a connection, but the impedance comparator114 will indicate an improper connection. In this instance, theprocessing module may disable the video decoder and/or the video DACs.

In another embodiment, the pull up resistor R3 may be sized to detectthe type of load coupled to the video output pin 40-44. For example, aheadphone has an impedance of about 50 Ohms while a video display has animpedance of approximately 75 Ohms. Thus, the pull up resistor R3 couldbe sized to provide a positive result when the 75 Ohm load is coupledthereto and a negative result when the 50 Ohm load is coupled thereto.Alternatively, the impedance comparator 114 may include multiple levelsof comparison to indicate no load, a 50 Ohm load, a short, a 75 Ohmload, etc.

While the preceding discussion has been presented for a video DACperspective, the teachings of the present invention may be used for anyDAC application. In addition, the teachings of the present invention maybe used in any combination to reduce power consumption of a multimediaSOC and/or provide a desired level of video output performance.

As may be used herein, the terms “substantially” and “approximately”provides an industry-accepted tolerance for its corresponding termand/or relativity between items. Such an industry-accepted toleranceranges from less than one percent to fifty percent and corresponds to,but is not limited to, component values, integrated circuit processvariations, temperature variations, rise and fall times, and/or thermalnoise. Such relativity between items ranges from a difference of a fewpercent to magnitude differences. As may also be used herein, theterm(s) “coupled to” and/or “coupling” and/or includes direct couplingbetween items and/or indirect coupling between items via an interveningitem (e.g., an item includes, but is not limited to, a component, anelement, a circuit, and/or a module) where, for indirect coupling, theintervening item does not modify the information of a signal but mayadjust its current level, voltage level, and/or power level. As mayfurther be used herein, inferred coupling (i.e., where one element iscoupled to another element by inference) includes direct and indirectcoupling between two items in the same manner as “coupled to”. As mayeven further be used herein, the term “operable to” indicates that anitem includes one or more of power connections, input(s), output(s),etc., to perform one or more its corresponding functions and may furtherinclude inferred coupling to one or more other items. As may stillfurther be used herein, the term “associated with”, includes directand/or indirect coupling of separate items and/or one item beingembedded within another item. As may be used herein, the term “comparesfavorably”, indicates that a comparison between two or more items,signals, etc., provides a desired relationship. For example, when thedesired relationship is that signal 1 has a greater magnitude thansignal 2, a favorable comparison may be achieved when the magnitude ofsignal 1 is greater than that of signal 2 or when the magnitude ofsignal 2 is less than that of signal 1.

The present invention has also been described above with the aid ofmethod steps illustrating the performance of specified functions andrelationships thereof. The boundaries and sequence of these functionalbuilding blocks and method steps have been arbitrarily defined hereinfor convenience of description. Alternate boundaries and sequences canbe defined so long as the specified functions and relationships areappropriately performed. Any such alternate boundaries or sequences arethus within the scope and spirit of the claimed invention.

The present invention has been described above with the aid offunctional building blocks illustrating the performance of certainsignificant functions. The boundaries of these functional buildingblocks have been arbitrarily defined for convenience of description.Alternate boundaries could be defined as long as the certain significantfunctions are appropriately performed. Similarly, flow diagram blocksmay also have been arbitrarily defined herein to illustrate certainsignificant functionality. To the extent used, the flow diagram blockboundaries and sequence could have been defined otherwise and stillperform the certain significant functionality. Such alternatedefinitions of both functional building blocks and flow diagram blocksand sequences are thus within the scope and spirit of the claimedinvention. One of average skill in the art will also recognize that thefunctional building blocks, and other illustrative blocks, modules andcomponents herein, can be implemented as illustrated or by discretecomponents, application specific integrated circuits, processorsexecuting appropriate software and the like or any combination thereof.

1. A system on a chip (SOC) comprises: a bus structure; a processingmodule coupled to the bus structure; read only memory (ROM) coupled tothe bus structure; random access memory (RAM) coupled to the busstructure; an external memory interface coupled to the bus structure; ananalog to digital conversion (ADC) module coupled to the bus structure;an audio digital to analog conversion (DAC) module coupled to the busstructure; a video decoder coupled to the bus structure; a plurality ofvideo DAC modules coupled to at least one of the video decoder and thebus structure; a plurality of video output pins coupled to correspondingoutputs of the plurality of video DAC modules; a plurality of jack sensemodules coupled to the plurality of video output pins, wherein theprocessing module functions to: enable one or more of the plurality ofjack sense modules to determine a video connection to the SOC; enablethe video decoder in a first mode when the video connection is of afirst type; and enable the video decoder in a second mode when the videoconnection is of a second type.
 2. The SOC of claim 1, wherein theprocess module further functions to: enable the video decoder in a thirdmode when the video connection is of a third type.
 3. The SOC of claim 2comprises: the first type of video connection corresponding to compositevideo; the second type of video connection corresponding to componentvideo; and the third type of video connection corresponding to S-video.4. The SOC of claim 1, wherein the processing module further functionsto: disable the video decoder when a null video connection is detected.5. The SOC of claim 1, wherein the processing module further functionsto: disable the plurality of video DAC modules when a null videoconnection is detected.
 6. The SOC of claim 1, wherein the processingmodule further functions to: enable one of the plurality of video DACmodules when the first type of video connection is detected; and enablemore than one of the plurality of video DAC modules when the second typeof video connection is detected.
 7. The SOC of claim 6, wherein theprocessing module further functions to: enable the one of the pluralityof video DAC modules when a composite video connection is detected;enable at least two of the plurality of video DAC modules when anS-video connection is detected; and enable at least three of theplurality of video DAC modules when a component video connection isdetected.
 8. The SOC of claim 1, wherein a jack sense module of theplurality of jack sense modules comprises: a switch; a pull up resistorcoupled to the switch and a corresponding one of the plurality of videooutput pins; and a circuit coupled to the pull up resistor, wherein,when a video cable is coupled to the corresponding one of the pluralityof video output pins, the circuit provides a first output and when avideo cable is not coupled to the corresponding one of the plurality ofvideo output pins, the circuit provides a second output.
 9. The SOC ofclaim 8, wherein the jack sense module further comprises at least oneof: a disconnect detector coupled to determine when the video cable hasbeen disconnected; and an impedance detector coupled to determinewhether impedance of the video cable being coupled to the correspondingone of the plurality of video output pins corresponds to an impedance ofa video connection and when the impedance of the video cable beingcoupled to the corresponding one of the plurality of video output pinscorresponds to an impedance of a video connection, indicating a properconnection.
 10. A system on a chip (SOC) comprises: a bus structure; aprocessing module coupled to the bus structure; read only memory (ROM)coupled to the bus structure; random access memory (RAM) coupled to thebus structure; an external memory interface coupled to the busstructure; an analog to digital conversion (ADC) module coupled to thebus structure; an audio digital to analog conversion (DAC) modulecoupled to the bus structure; a video decoder coupled to the busstructure; a plurality of video DAC modules coupled to at least one ofthe video decoder and the bus structure; a plurality of video outputpins coupled to corresponding outputs of the plurality of video DACmodules; a plurality of jack sense modules coupled to the plurality ofvideo output pins, wherein the processing module functions to: enableone or more of the plurality of jack sense modules to determine a videoconnection to the SOC; enable one of the plurality of video DAC moduleswhen the video connection is of a first type; and enable more than oneof the plurality of video DAC modules when the video connection is of asecond type.
 11. The SOC of claim 10, wherein the processing modulefurther functions to: enable the one of the plurality of video DACmodules when a composite video connection is detected; enable at leasttwo of the plurality of video DAC modules when an S-video connection isdetected; and enable at least three of the plurality of video DACmodules when a component video connection is detected.
 12. The SOC ofclaim 11, wherein the processing module further functions to: disablethe plurality of video DAC modules when a null video connection isdetected.
 13. The SOC of claim 10, wherein the processing module furtherfunctions to: enable the video decoder in a first mode when the videoconnection is of the first type; and enable the video decoder in asecond mode when the video connection is of the second type.
 14. The SOCof claim 13, wherein the process module further functions to: enable thevideo decoder in a third mode when the video connection is of a thirdtype.
 15. The SOC of claim 14 comprises: the first type of videoconnection corresponding to composite video; the second type of videoconnection corresponding to component video; and the third type of videoconnection corresponding to S-video.
 16. The SOC of claim 13, whereinthe processing module further functions to: disable the video decoderwhen a null video connection is detected.
 17. The SOC of claim 10,wherein a jack sense module of the plurality of jack sense modulescomprises: a switch; a pull up resistor coupled to the switch and acorresponding one of the plurality of video output pins; and a circuitcoupled to the pull up resistor, wherein, when a video cable is coupledto the corresponding one of the plurality of video output pins, thecircuit provides a first output and when a video cable is not coupled tothe corresponding one of the plurality of video output pins, the circuitprovides a second output.
 18. The SOC of claim 17, wherein the jacksense module further comprises at least one of: a disconnect detectorcoupled to determine when the video cable has been disconnected; and animpedance detector coupled to determine whether impedance of the videocable being coupled to the corresponding one of the plurality of videooutput pins corresponds to an impedance of a video connection and whenthe impedance of the video cable being coupled to the corresponding oneof the plurality of video output pins corresponds to an impedance of avideo connection, indicating a proper connection.
 19. An integratedcircuit (IC) comprises: a plurality of video DAC modules; a plurality ofvideo output pins coupled to corresponding outputs of the plurality ofvideo DAC modules; and a plurality of jack sense modules coupled to theplurality of video output pins, wherein when one of the plurality ofjack sense modules determines a video connection to the IC, acorresponding one of the plurality of video DAC modules is enabled andwhen more that one of the plurality of jack sense modules determines avideo connection to the IC, a corresponding number of the plurality ofvideo DAC modules is enabled.
 20. The IC of claim 19 further comprises:when the one of the plurality of jack sense modules determines that thevideo connection is a composite video connection, the corresponding oneof the plurality of video DAC modules is enabled to support thecomposite video connection; when the more that one of the plurality ofjack sense modules determines that the video connection is an S-videoconnection, two of the plurality of video DAC modules are enabled tosupport the S-video connection; and when the more that one of theplurality of jack sense modules determines that the video connection isa component video connection, three of the plurality of video DACmodules are enabled to support the composite video connection.
 21. TheIC of claim 19, wherein a jack sense module of the plurality of jacksense modules comprises: a switch; a pull up resistor coupled to theswitch and a corresponding one of the plurality of video output pins;and a circuit coupled to the pull up resistor, wherein, when a videocable is coupled to the corresponding one of the plurality of videooutput pins, the circuit provides a first output and when a video cableis not coupled to the corresponding one of the plurality of video outputpins, the circuit provides a second output.
 22. The IC of claim 21,wherein the jack sense module further comprises at least one of: adisconnect detector coupled to determine when the video cable has beendisconnected; and an impedance detector coupled to determine whetherimpedance of the video cable being coupled to the corresponding one ofthe plurality of video output pins corresponds to an impedance of avideo connection and when the impedance of the video cable being coupledto the corresponding one of the plurality of video output pinscorresponds to an impedance of a video connection, indicating a properconnection.